We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Vacuum Lamination Equipment.
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Vacuum Lamination Equipment - Company Ranking(7 companies in total)

Last Updated: Aggregation Period:Feb 18, 2026〜Mar 17, 2026
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
Board size: 20mm × 20mm to 120mm × 120mm Upper stage: Quartz (UV irradiation area 110mm long) Lower stage: Aluminum Pressing force: 40... Purpose: Research and Development (Key Technologies) Achievements: Material development, test sample production, process verification, etc...
【Basic Specifications】 ■ Maximum substrate size: 300mm × 400mm (flat), 220mm × 330mm (R800mm curved) ■ Supported curves: convex, concave, 2.... For more details, please refer to the PDF document or feel free to contact us.
Basic Specifications Board Size Max: 300 (W) x 400 (L) mm; Thickness: 0.5~11mm Overlay Accuracy Below 10μm (excluding pattern pitch to... Stacking of glass substrates, etc.
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  1. Featured Products
    Tabletop Vacuum Laminator Vacuum Bonding DeviceTabletop Vacuum Laminator Vacuum Bonding Device
    overview
    Board size: 20mm × 20mm to 120mm × 120mm Upper stage: Quartz (UV irradiation area 110mm long) Lower stage: Aluminum Pressing force: 40...
    Application/Performance example
    Purpose: Research and Development (Key Technologies) Achievements: Material development, test sample production, process verification, etc...
    "Airbag-type vacuum laminator" Vacuum lamination device"Airbag-type vacuum laminator" Vacuum lamination device
    overview
    【Basic Specifications】 ■ Maximum substrate size: 300mm × 400mm (flat), 220mm × 330mm (R800mm curved) ■ Supported curves: convex, concave, 2....
    Application/Performance example
    For more details, please refer to the PDF document or feel free to contact us.
    Vacuum lamination device, vacuum bonding deviceVacuum lamination device, vacuum bonding device
    overview
    Basic Specifications Board Size Max: 300 (W) x 400 (L) mm; Thickness: 0.5~11mm Overlay Accuracy Below 10μm (excluding pattern pitch to...
    Application/Performance example
    Stacking of glass substrates, etc.